MediaTek Dimensity 9300+ Unveiled at MDDC 2024: On-Device AI, 4nm Process, and Advanced Features

MediaTek Dimensity 9300+ Unveiled at MDDC 2024 - On-Device AI, 4nm Process, and Advanced Features - Tech News - Electronics Updates - Before You Take
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At the MediaTek Dimensity Developer Conference (MDDC) 2024, MediaTek unveiled its latest powerhouse, the MediaTek Dimensity 9300+ chipset, showcasing significant upgrades and cutting-edge features over its predecessor, the Dimensity 9300 processor. Let’s delve into the details of this groundbreaking chipset.

 

 

 

Key Points:

 

MediaTek unveiled the Dimensity 9300+ chipset at MDDC 2024.

 

The chipset boasts advanced on-device AI capabilities and significant performance enhancements.

 

Fabricated on TSMC’s 4nm process, it offers improved CPU, GPU, and APU performance.

 

MediaTek integrates NeuroPilot LORA Fusion 2.0 for AI-driven tasks and large language model support.

 

The Dimensity 9300+ features cutting-edge imaging capabilities and network optimization technologies.

 

Features:

 

On-device AI: Supports NeuroPilot LORA Fusion 2.0 and large language model processing.

 

APU 790 AI engine: Delivers up to 10% better AI performance.

 

CPU configuration: Cortex-X4 prime core, Cortex-X4 performance cores, and Cortex-A720-based efficiency cores.

 

GPU: 12-core ARM Immortalis-G720 MC12 GPU with ray tracing and gaming optimizations.

 

Imaging: Imagiq 990 ISP unit with AI Semantic Analysis Video Engine for enhanced videography.

 

Network optimization: HyperEngine’s Network Observation System (NOS) for improved connectivity and power efficiency.

 

Process technology: TSMC’s 4nm process for enhanced performance and power efficiency.

 

Specifications:

 

Processor: Octa-core CPU with Cortex-X4 cores and Cortex-A720-based efficiency cores.

 

AI Engine: APU 790 AI engine for AI-driven tasks and large language model processing.

 

GPU: 12-core ARM Immortalis-G720 MC12 GPU with ray tracing capabilities.

 

Imaging: Imagiq 990 ISP unit with AI Semantic Analysis Video Engine.

 

Connectivity: Enhanced network optimization with HyperEngine’s Network Observation System (NOS).

 

Process technology: Fabricated on TSMC’s third-generation 4nm process.

 

Conclusion:

The MediaTek Dimensity 9300+ chipset marks a significant advancement in mobile processing technology, offering unparalleled AI capabilities, enhanced CPU and GPU performance, and cutting-edge imaging features. With its innovative features, advanced specifications, and efficient network optimizations, the Dimensity 9300+ sets a new standard for mobile computing and paves the way for next-generation smartphones and devices.

 

 

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