In the ever-evolving landscape of chip packaging technology, Intel has set its sights on an ambitious endeavor: crafting a chip housing a staggering trillion transistors by 2030. This audacious goal aligns with the trajectory of Moore’s law, which initially proposed a doubling of transistors annually, a concept fostered by Fairchild Semiconductor and later championed by Intel. However, over time, this exponential growth slowed to a three-year cycle.

Key Points:

Intel’s Trillion-Transistor Chip Goal by 2030:

Objective: Crafting a chip with a trillion transistors by 2030, doubling transistor count yearly akin to Moore’s law.

Moore’s Law Slowdown: Moore’s law’s original pace slowed to a three-year doubling cycle over time.

“Super Moore’s Law” Vision:

Intel’s Vision: Intel aims to surpass Moore’s Law by 2031, introducing “Super Moore’s Law” or “Moore’s Law 2.0.”

Strategic Collaborations: TSMC and Samsung Foundry collaborations are crucial in this pursuit.

Industry Transition: Qualcomm’s shift to TSMC and Samsung Foundry signifies a broader industry shift.

Challenges and Strategies:

Rate of Doubling Transistors: Acknowledgment of a slower doubling rate every three years.

Technology for Trillion Transistors: Strategies like advanced packaging and RibbonFET technology are employed for increased transistor integration.

Economic Realities: Intel’s considerable investment, with modern fabrication facility costs doubling to $20 billion.

Trillion-Transistor Milestone:

Intel’s Aspiration: Integrating a trillion transistors within a chip isn’t new, reflecting a gradual scaling slowdown.

Diverse Technological Approaches: RibbonFET technology and PowerVIA Power Delivery among methods for increased transistor density.

Economic Impact: Escalating costs – fabrication facility expenses doubled from $10 billion to $20 billion.