As the mobile chipset market continues to evolve, MediaTek is gearing up to launch its latest addition to the Dimensity lineup, the Dimensity 8400. Expected to debut by late 2024, the Dimensity 8400 is positioned as a sub-premium SoC, likely to follow in the footsteps of its flagship sibling, the Dimensity 9400. Rumors suggest that this new chip will incorporate an all-big-core design architecture, aligning it with similar high-performance standards seen in Qualcomm’s Snapdragon 8 Elite.

Key Points

Next-gen sub-premium chipset expected from MediaTek by the end of 2024.

Core Structure: Likely to feature an all-big-core architecture with ARM Cortex-A725.

Benchmark Scores: Expected to achieve 1.7-1.8 million on AnTuTu.

Manufacturing Process: Built on TSMC’s efficient 4nm node.

Performance Goals: Aims to surpass Snapdragon 8 Gen 2 and rival Gen 3.

Device Partners: Likely to appear in Xiaomi, Redmi, or Poco devices.

Market Impact: Positions MediaTek strongly in the premium-performance segment

Dimensity 8400 Core Architecture and Performance

According to a reputable source, Digital Chat Station, the Dimensity 8400 will leverage an all-big-core configuration, meaning each core is designed for high performance rather than a mix of efficiency and performance cores. This aligns with MediaTek’s approach for the Dimensity 9300 and 9400, reinforcing the brand’s commitment to power-intensive performance. The Cortex-A725 core is expected to be the prime processing unit, supporting the advanced architecture for demanding applications.

Built on TSMC’s Efficient 4nm Process

In line with its predecessors, the Dimensity 8400 will use TSMC’s advanced 4nm manufacturing process, ensuring the chip delivers top-notch efficiency without compromising on performance. This smaller fabrication size enables enhanced power savings, allowing devices powered by the 8400 to support longer battery life, an important factor for users in performance-focused smartphones.

Impressive Benchmark Scores

Performance leaks from Digital Chat Station suggest that the Dimensity 8400 will achieve a high AnTuTu benchmark score between 1.7 and 1.8 million, putting it in direct competition with Qualcomm’s Snapdragon 8 series. For comparison, the Snapdragon 8 Gen 2 scores around 1.6 million, while the more recent 8 Gen 3 pushes closer to 2 million. This places the 8400 at a competitive advantage, delivering impressive speeds in a sub-premium segment that seeks flagship-level power.

Anticipated Device Integrations and Launch

Hints in Xiaomi’s HyperOS codebase reveal that the Dimensity 8400 could soon feature in upcoming devices by Xiaomi, Redmi, or Poco. With flagship features and performance enhancements, the Dimensity 8400 is anticipated to deliver significant value to these brands’ sub-premium offerings. MediaTek’s continued collaborations in the competitive smartphone landscape underscore its strategy to solidify market presence in multiple device tiers.

Conclusion

The MediaTek Dimensity 8400 chipset is shaping up to be a competitive player in the high-performance smartphone market. Combining a big-core architecture, efficient manufacturing, and impressive benchmarks, it is poised to offer flagship-like capabilities in the sub-premium range. With a launch anticipated later this year or early 2025, the Dimensity 8400 may redefine expectations for performance and efficiency, positioning MediaTek as a strong contender alongside industry leaders.