MediaTek is preparing to make another leap in mobile chip innovation. Following the recent launch of the Dimensity 9400+, leaks surrounding its upcoming Dimensity 9500 SoC have begun circulating online, revealing key architectural upgrades, cutting-edge manufacturing techniques, and a renewed focus on AI and graphics performance. Here’s everything we know so far about this next-gen flagship chipset.

Key Points:

Based on TSMC’s N3P 3nm process

New Immortalis-Drage GPU with better ray tracing

All-large core architecture with ARM X9 and A7 series

AI-focused NPU 9.0 with up to 100 TOPS

Supports LPDDR5X RAM and UFS 4.1 storage

Sticking to 3nm due to Apple’s early access to 2nm tech

Manufactured on TSMC’s Advanced 3nm N3P Node

One of the standout highlights of the Dimensity 9500 is its use of TSMC’s N3P process—a second-generation 3nm node that promises significant improvements in power efficiency and performance. This move makes MediaTek one of the few chipmakers working at the forefront of 3nm architecture, joining the ranks of Apple and Qualcomm in adopting cutting-edge silicon technology.

New Performance Core Configuration: Travis, Alto, and Gelas

According to prominent leaker Digital Chat Station, the Dimensity 9500 will utilize an all-big core architecture consisting of:

1x Travis Core (likely ARM Cortex-X9)

3x Alto Cores (also part of the new X9 family)

4x Gelas Cores (next-gen ARM A7 large cores)

This design showcases a significant departure from traditional big.LITTLE configurations. All cores are now performance-focused, likely improving multi-core throughput and overall performance for high-end smartphones.

Immortalis-Drage GPU: Ray Tracing Redefined

On the graphics front, the Immortalis-Drage GPU will succeed its predecessor with a re-engineered microarchitecture that enhances ray tracing capabilities while cutting back on power consumption. This means smoother visuals and more realistic lighting and shadows in mobile gaming—an area where MediaTek is clearly pushing boundaries.

Advanced AI and Memory Architecture

The Dimensity 9500 will feature an upgraded NPU 9.0, designed to deliver impressive AI performance estimated at up to 100 TOPS (trillion operations per second). This level of AI processing power could be instrumental for real-time voice processing, advanced image recognition, on-device generative AI, and more.

To complement this, MediaTek is pairing the chip with:

16MB of L3 cache

10MB of SLC (System Level Cache)

Support for LPDDR5X RAM with speeds up to 10,667 Mbps

Support for quad-channel UFS 4.1 storage

This hardware combination points to ultra-fast performance, smooth multitasking, and faster app and data access for flagship smartphones.

Why MediaTek Stuck to 3nm

Originally, MediaTek was planning to shift to TSMC’s upcoming 2nm process, but cost limitations and Apple’s early production reservation for the A20 Pro chip—expected to power the iPhone 18 series in 2026—meant the chipmaker had to adjust its strategy. As a result, the Dimensity 9500 will remain on the 3nm N3P node, which still offers industry-leading performance and efficiency.

Expected Devices and Launch Timeline

While there is no official confirmation yet, the Dimensity 9500 is expected to debut in flagship smartphones from OPPO, Vivo, Xiaomi, and iQOO later this year or early 2026. Given MediaTek’s recent collaborations, it’s likely that the new SoC will be paired with premium camera hardware, high-refresh-rate AMOLED displays, and robust gaming features.

Conclusion:

With the Dimensity 9500, MediaTek appears ready to challenge Qualcomm and Apple on all fronts—from raw power and ray tracing to advanced AI processing and memory bandwidth. If the leaked specs are accurate, this chipset could redefine what Android flagship phones are capable of.

Stay tuned for more updates as we get closer to the official announcement.