Upcoming Launch: Snapdragon 7 Gen 3 and Dimensity 8300 Mid-Range Chipsets Promise Superior Performance

Upcoming Launch - Snapdragon 7 Gen 3 and Dimensity 8300 Mid-Range Chipsets Promise Superior Performance - Tech News - Updates - Before You Take
Facebook
Twitter
LinkedIn
WhatsApp
Telegram
ADVERTISEMENT

 

Qualcomm and MediaTek are poised to roll out their mid-range chipsets in the coming weeks. Leaks suggest that both the Snapdragon 7 Gen 3 and Dimensity 8300 will make their grand entries around similar timelines. The Snapdragon 7 Gen 3 is rumored to retain the same 1+3+4 architecture as its predecessor, boasting one prime core, three performance cores, and four efficiency cores.

 

Key Points:

 

Arrival of Snapdragon 7 Gen 3 and Dimensity 8300

The tech realm is buzzing with the imminent release of the Snapdragon 7 Gen 3 and Dimensity 8300. Recent leaks unveiled the Snapdragon 7 Gen 3 specifications, while there are reports suggesting that the Dimensity 8300 could power the upcoming Redmi K70e. Now, fresh leaks have surfaced online, revealing the anticipated launch window for both of these cutting-edge chipsets.

 

Expected Launch Timeline

According to the tipster WHY LAB, both chipsets are set to make their debut within the next two weeks. There are speculations that the Honor 100, set for a November 23 launch in China, might be the first phone featuring the Snapdragon 7 Gen 3 chip. This chipset is expected to power various smartphones, including the Vivo S18, Vivo V30, and the global edition of the OnePlus Ace 3 (also known as the OnePlus Nord 4). Conversely, the Dimensity 8300 might find its place in the Redmi K70e, part of the anticipated K70 series launch in China by month-end.

 

Snapdragon 7 Gen 3 and Dimensity 8300 Specs (Expected):

 

Qualcomm Snapdragon 7 Gen 3

The Snapdragon 7 Gen 3 is rumored to retain the 1+3+4 architecture, housing cores clocked at 2.63GHz (prime), 2.4GHz (performance), and 1.8GHz (efficiency). A leaked ARM Cortex-A715 configuration might power this setup. With the model number SM7550, this chipset is anticipated to leverage TSMC’s 4nm process, potentially paired with the Adreno 720 GPU.

 

MediaTek Dimensity 8300

Expected to integrate a single Cortex-X3 super-large core at 2.8GHz, three Cortex-A715 performance cores clocked at 2.4GHz, and four Cortex-A510 efficiency cores operating at 1.6GHz. On the graphics side, the Dimensity 8300 might feature a G520 MC6 GPU running at 850MHz.

 

With their launch imminent, the precise specifications and the devices set to harness the power of these chipsets will soon be unveiled.

 

Via @ gizmochina

We will be happy to hear your thoughts

Leave a reply

Also, Read

ADVERTISEMENT

Latest News

ADVERTISEMENT
Deal of the Day
ADVERTISEMENT

Related or Latest Posts

ADVERTISEMENT
Deal of the Day
ADVERTISEMENT

Mobiles | Tablets

ADVERTISEMENT

Laptops | Desktops | Monitors

ADVERTISEMENT

Smartwatches | Smart Rings | TWS Earbuds

ADVERTISEMENT

Latest Electric Vehicles News

ADVERTISEMENT

Televisions | TV Sticks | Projectors

ADVERTISEMENT

Speakers | Soundbars | Headphones | keyboards | Mouse

ADVERTISEMENT

Power Banks | Wireless Chargers | Trimmer

ADVERTISEMENT

Air Fryers | Electric Kettles & Heaters | Vacuum Cleaners

ADVERTISEMENT

Refrigerators | Microwave Ovens | Water Purifier

ADVERTISEMENT

Cameras | Drones

ADVERTISEMENT

IT Industry | Business News

ADVERTISEMENT

Latest Space News & Updates

ADVERTISEMENT

Latest OTT Releases

ADVERTISEMENT

New Launches | Informative News | Software Updates

ADVERTISEMENT

Events News | Tech Reviews | Offer Sale | Web Stories

ADVERTISEMENT

Telecom News | Sports News

ADVERTISEMENT

Latest Gaming News & Updates

ADVERTISEMENT

3D Printers | AR VR Headsets News

Before You Take
Logo
Register New Account
Reset Password
Compare items
  • Total (0)
Compare