For years, MediaTek and Qualcomm have been competing in the mobile chip market, with Qualcomm leading the way in the high-end segment with its Snapdragon chips. MediaTek, on the other hand, has made its mark with chips for entry-level and midrange smartphones. However, with the introduction of its 5G Dimensity chips, MediaTek has been gaining market share from its biggest rival, but not enough to challenge Qualcomm’s dominance in the flagship market.
Dimensity 9300: MediaTek’s Next-Gen Flagship SoC
According to well-known tech blogger @DCS on Weibo, MediaTek’s next-generation flagship SoC will be called Dimensity 9300. The chip is expected to compete head-to-head with Qualcomm’s upcoming Snapdragon 8 Gen3, set to release later this year.
N4P Process: MediaTek’s Secret Weapon
One of the biggest advantages of the Dimensity 9300 is that it utilizes TSMC’s N4P process. Compared to the initial 5nm technology, known as N5, the N4P process has an 11% performance boost and is six percentage points better than N4. It also has a 22% improvement in power efficiency, with a 6% increase in transistor density. Additionally, the N4P process makes it easier to transfer products based on the 5nm platform, reducing R&D costs and enabling faster and more energy-efficient updates.
New Chip Design: Really Huge Center + Enormous Center + Little Center
The MediaTek Dimensity 9300 will feature a new chip design with a format plan of really huge center + enormous center + little center. The really huge center is expected to be Cortex X4, the enormous center could be Cortex A715, and the little center might be A515.
Expected Release Date
The Dimensity 9300 is expected to debut later this year, and its performance will be closely compared to that of the Snapdragon 8 Gen3 from Qualcomm. It will be interesting to see how these two rivals compete in the flagship market, as they continue to push each other to innovate and improve their products.
