Google is set to take a significant leap forward with its upcoming Pixel 10 series by transitioning the production of its custom Tensor chips from Samsung Foundry to Taiwan Semiconductor Manufacturing Company (TSMC). This strategic change is expected to boost performance, efficiency, and long-term innovation in Pixel devices.

Key Points:

Pixel 10 series to feature the first TSMC-made Tensor G5 chip

Chip to be fabricated on TSMC’s 3nm N3E process

Move expected to improve performance, thermal management, and efficiency

Long-term partnership includes potential cloud TPU and AI chip collaborations

Pixel 10 lineup could include four models, including a foldable variant

Google aims to align with top-tier hardware players like Apple

A Major Break from Samsung Foundry

According to a report from DigiTimes, Google has finalized a long-term manufacturing agreement with TSMC, the world’s most advanced semiconductor foundry. This shift begins with the Tensor G5 chip, expected to debut in the Pixel 10 series in 2025. Unlike previous Tensor chips, which were produced by Samsung using a 4nm process, the G5 will be built using TSMC’s advanced 3nm N3E node.

This move is more than just a change in supplier—it signals Google’s growing ambitions in the hardware space and its intent to resolve key issues plaguing previous Tensor generations, such as overheating, power inefficiency, and poor yields.

Tensor G5: What We Know So Far

Internally codenamed “Laguna,” the Tensor G5 SoC is expected to bring notable architectural and performance improvements. While exact specifications remain under wraps, early leaks suggest the following configuration:

CPU: 1x Cortex-X4 + 5x Cortex-A725 + 2x Cortex-A520

TPU: Custom Google TPU for AI and machine learning

DSP: Google GXP digital signal processor

Edge AI: Google EdgeTPU for on-device inference

Audio: Always-On Compute (AoC) processor for audio tasks

Memory: Google’s Emerald Hill memory co-processor

GPU: DXT series graphics from Imagination Technologies

The use of TSMC’s 3nm process is expected to drastically reduce power consumption while increasing both peak and sustained performance.

A Multi-Year Collaboration Beyond Smartphones

Reports suggest that Google executives recently visited TSMC in Taiwan to explore not just smartphone chip production, but also collaboration in other areas. These include custom silicon for cloud data centers, TPUs (Tensor Processing Units), IC design, server hardware, and liquid cooling technologies.

This long-term strategic partnership could see TSMC playing a key role in Google’s broader AI and cloud infrastructure roadmap over the next decade.

The Pixel 10 Lineup: More Than Just One Flagship

Google’s upcoming Pixel 10 series is expected to be its most diversified yet. Leaks point to four possible devices:

Pixel 10

Pixel 10 Pro

Pixel 10 Pro XL

Pixel 10 Pro Fold (foldable model)

By expanding the range and improving chip performance, Google aims to better compete with top-tier players like Apple, who also use TSMC for their A-series chips.

Why This Move Matters

Shifting to TSMC is not just about better chip specs. It also reflects Google’s desire to control its hardware destiny more tightly and ensure consistent performance across its ecosystem. Samsung’s ongoing yield problems, particularly with the Exynos 2500, have only reinforced the need for a more reliable foundry partner.

TSMC’s proven track record with clients like Apple, Qualcomm, and AMD makes it a natural fit for Google’s long-term ambitions.

Final Thoughts

With the Tensor G5 chip and a shift to TSMC’s 3nm process, the Pixel 10 series could mark a pivotal turning point for Google’s smartphone ambitions. The move promises more efficient, powerful, and reliable devices—and a tighter integration between software and hardware. As AI and on-device processing become increasingly central to smartphone experiences, this change positions Google to lead the next wave of innovation.

Expect more details to emerge as we approach the Pixel 10 launch window in late 2025.