MediaTek, the Taiwanese semiconductor manufacturer, has announced the launch of its latest system-on-chip (SoC), the MediaTek Dimensity 6100+, as part of the Dimensity 6000 series. This new offering from MediaTek promises exceptional power efficiency, stunning displays, high frame rates, AI-powered camera technologies, and reliable Sub-6 5G connectivity.
The Dimensity 6100+ chipset integrates an enhanced 5G modem, supports 10-bit displays, and offers powerful camera features, including AI-bokeh for captivating portraits and selfies. Let’s explore the features and capabilities of this new SoC in more detail.
Powerful Performance and Enhanced Camera Capabilities
The newly unveiled MediaTek Dimensity 6100+ is an octa-core 6nm processor, featuring two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores. MediaTek has made significant improvements with this chipset, including support for AI-powered cameras, 10-bit displays, exceptional user experience (UX) and GPU performance, and rich peripheral features. The Dimensity 6100+ boasts up to 108MP Non-ZSL camera support and is capable of capturing 2K videos at 30 fps.
Additionally, the Dimensity 6100+ incorporates UltraSave 3.0+ technology, offering a 20% reduction in 5G power consumption compared to competitive solutions. The chipset also includes camera features such as AI-bokeh, enabling users to capture stunning selfies with impressive background blur. MediaTek is collaborating with Arcsoft to bring AI-color technology to mainstream devices, providing users with enhanced creativity options.
Immersive Displays and Gaming Experience
The Dimensity 6100+ processor supports premium 10-bit displays, delivering vibrant and true-to-life colors. It also offers support for refresh rates ranging from 90Hz to 120Hz, ensuring a smooth and immersive user experience. MediaTek’s HyperEngine 5.0 gaming technology is integrated into the chipset, providing optimized performance for game engines and intense gameplay.
Robust Connectivity and Storage
The Dimensity 6100+ features a 3GPP Release-16 standard 5G modem, ensuring reliable and fast 5G connectivity. The chipset supports LPDDR4x memory and UFS 2.2 storage, enabling smooth multitasking and quick app launches. It can be paired with the Mali-G57 MC2 GPU for enhanced graphics processing capabilities.
The chipset offers a comprehensive range of connectivity options, including Wi-Fi 5, Bluetooth v5.2, GPS (L1CA+L5), BeiDou, Glonass, Galileo, QZSS, NavIC, 4G Carrier Aggregation, and support for SA/NSA modes.
Availability and Previous Dimensity 6000 Series
Smartphones powered by the Dimensity 6100+ will make their debut in the market in the third quarter of 2023. This release follows MediaTek’s introduction of the Dimensity 6000 series SoCs, such as the Dimensity 6020 and Dimensity 6080 chipsets earlier this year. The Dimensity 6020 is built on a 7nm process and features two Cortex-A76 cores and six Cortex-A55 cores.
On the other hand, the Dimensity 6080 is manufactured using a 6nm process and also incorporates two Cortex-A76 cores and six Cortex-A55 cores. Both chipsets offer MediaTek HyperEngine 5.0 gaming technology support, dual 5G SIM support, and compatibility with LPDDR4x RAM and UFS 2.2 storage.
With the MediaTek Dimensity 6100+, MediaTek continues to drive innovation and push boundaries in the mobile industry, empowering smartphone manufacturers to deliver cutting-edge devices that offer exceptional performance, immersive visuals, and seamless 5G connectivity.
